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SML2108F View Datasheet(PDF) - Summit Microelectronics

Part Name
Description
MFG CO.
SML2108F
Summit-Microelectronics
Summit Microelectronics 
SML2108F Datasheet PDF : 21 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SML2108
PRELIMINARY
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ...................... 55°C to 125°C
Storage Temperature ........................... 65°C to 150°C
Lead Solder Temperature (10 secs) ................... 300 °C
*COMMENT
Stresses listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions
outside those listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for extended
periods may affect device performance and reliability.
ELECTRICAL TABLES
(Over Recommended Operating Conditions; Voltages are relative to GND)
Symbol
Parameter
Conditions
Min.
Typ.
Typical ADC Performance
S/N
THD
Signal to Noise ratio
Total harmonic distortion
TA = 25ºC
70
80
Peak harmonic intermodulation
2nd Order
80
distortion
3rd Order
80
DC Accuracy
Resolution
8
Reolution for which no missing
codes are guaranteed
8
Relative accuracy
±½
DNL
±1
Positive full scale error
±2
VSS = 5V
±2
Unipolar offset error
VSS = 2.7V to
3.6V
±2
Max.
Units
dB
dB
dB
dB
Bits
Bits
LSB
LSB
LSB
LSB
LSB
2053 Elect Table A
SUMMIT MICROELECTRONICS, Inc.
2053 2.2 11/07/00
5

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