STTS2002(2011) View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

STTS2002
(Rev.:2011)

2.3 V memory module temperature sensor with a 2 Kb SPD EEPROM

STMicroelectronics 

Package mechanical data

STTS2002

The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN)

are shown in Figure 18.

The preferred implementation with wide corner pads enhances device centering during

assembly, but a narrower option is defined for modules with tight routing requirements.

Figure 18. Landing pattern - TDFN8 package (DN)

e4

e2

e/2

e/2

e

L

K

E3

E3

K

D2

D2/2

D2/2

E2/2

E2

E2/2

L

b2

b

b

K2

K2

K2

b4

ai14000

46/52

Doc ID 15389 Rev 5

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