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STM1404BSOJQ6 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
STM1404BSOJQ6 Datasheet PDF : 35 Pages
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Package mechanical data
8
Package mechanical data
STM1404
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 29. QFN16 – 16-lead, quad, flat package, no lead, 3 x 3 mm body size, outline
D
E
A3
ddd C
b
L
E2
A1 A
e
K
1
2
Ch
3
Note:
Drawing is not to scale.
K
D2
QFN16-A
30/36

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