M24C64-FMH6TP View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24C64-FMH6TP

64-Kbit serial I²C bus EEPROM

STMicroelectronics 

Package mechanical data

M24C64-W M24C64-R M24C64-F

Figure 22. WLCSP 5-bump wafer-length chip-scale package outline

(M24C64-FCS6TP/K)

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1. Drawing is not to scale.

2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).

Table 23. WLCSP 5-bump wafer-length chip-scale package mechanical data

(M24C64-FCS6TP/K)

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

0.545

0.490 0.600 0.0215

0.0193

0.0236

A1

0.190

0.0075

A2

0.355

b(2)

0.270

0.0140

0.0106

D

0.959

1.074 0.0378

E

1.073

1.168 0.0422

e

0.693

0.0273

e1

0.400

0.0157

0.0423

0.0460

e2

0.3465

0.0136

F

0.280

0.0110

G

0.190

0.0075

aaa

0.110

eee

0.060

0.0043

0.0024

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension measured at the maximum bump diameter parallel to primary datum Z.

DocID16891 Rev 30

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