M24C64-FMH6TP View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24C64-FMH6TP

64-Kbit serial I²C bus EEPROM

STMicroelectronics 

M24C64-W M24C64-R M24C64-F

9

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Figure 17. UFDFPN5 (MLP5) – package outline (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

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N

/

3LQ

3LQ

E

(

$

(

$

H

'

7RSYLHZ

PDUNLQJVLGH

6LGHYLHZ

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$8.B0(B9

1. On the bottom side, pin 1 is identified by the specific pad shape and, on the top side, pin 1 is defined from

the orientation of the marking: when reading the marking, pin 1 is below the upper left package corner.

Table 18. UFDFPN5 (MLP5) – package dimensions (UFDFPN: Ultra thin Fine pitch

Dual Flat Package, No lead)

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

A1

b

D

D1

E

E1

e

L

k

1.

0.550

–

0.220

1.700

1.500

1.400

0.220

0.400

0.550

0.400

0.500

0

0.180

1.600

1.400

1.300

0.180

–

0.500

–

0.600

0.050

0.260

1.800

1.600

1.500

0.260

–

0.600

–

0.0217

–

0.0087

0.0669

0.0591

0.0551

0.0087

0.0157

0.0217

0.0157

0.0197

0

0.0071

0.0630

0.0551

0.0512

0.0071

–

0.0197

–

0.0236

0.0020

0.0102

0.0709

0.0630

0.0591

0.0102

–

0.0236

–

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