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DESCRIPTION

The HMA124, HMA121 series and HMA2701 series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 2.54 mm.

The HMAA2705 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a single silicon phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 2.54mm.

FEATURES

• Compact 4-PIN PACKAGE

(2.4 mm maximum standoff height)

• Current Transfer Ratio in selected groups

HMA121: 50–600% HMA2701: 50–300%

HMA121A: 100–300% HMA2701A: 150–300%

HMA121B: 50–150% HMA2701B: 80–160%

HMA121C: 100–200% HMA124: 100% MIN

HMA121D: 50–100% HMAA2705: 50–300%

HMA121E: 150–300%

HMA121F: 100–600%

• Available in tape and reel quantities of 500 and 2500.

• Applicable to Infrared Ray reflow (230°C max, 30 seconds.)

• Creepage ≥5 mm, typical 5.2 mm

• Clearance ≥5 mm, typical 5.2 mm

Description

The FODM124, FODM121 series, and FODM2701 consists of a gallium arsenide infrared emitting diode driving a phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 2.54mm. The FODM2705 consists of two gallium arsenide infrared emitting diodes connected in inverse parallel for AC operation.

Features

■More than 5mm creepage/clearance

■Compact 4-PIN surface mount PACKAGE (2.4mm maximum standoff height)

■Current Transfer Ratio in selected groups

DC Input:

FODM121: 50–600% FODM2701: 50–300%

FODM121A: 100–300% FODM124: 100% MIN

FODM121B: 50–150%

FODM121C: 100–200%

ACInput:

FODM2705: 50–300%

■Available in tape and reel quantities of 2500

■Applicable to Infrared Ray reflow (260°C max, 10 sec.)

Description
The FODM124, FODM121, and FODM2701 series consists of a gallium arsenide infrared emitting diode driving a phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 2.54 mm. The FODM2705 series consists of two gallium arsenide infrared emitting diodes connected in inverse parallel for AC operation.
   
Features
■ >5mm creepage/clearance
■ Compact 4-PIN surface mount PACKAGE
    (2.4mm maximum standoff height)
■ Current Transfer Ratio in selected groups
    DC Input:
    FODM121: 50–600%        FODM2701: 50–300%
    FODM121A: 100–300%    FODM2701A: 150–300%
    FODM121B: 50–150%      FODM2701B: 80–160%
    FODM121C: 100–200%    FODM124: 100% MIN
    FODM121D: 50–100%
    FODM121E: 150–300%
    FODM121F: 100–600%
    FODM121G: 200–400%
    AC Input:
    FODM2705: 50–300%
■ Available in tape and reel quantities of 500 and 2500
■ Applicable to Infrared Ray reflow
    (260°C max, 10 seconds)
■ C-UL, UL and VDE* certifications
   
Applications
■ Digital logic inputs
■ Microprocessor inputs
■ Power supply monitor
■ Twisted pair line receiver
■ Telephone line receiver
   

DESCRIPTION

The HMHA281, HMHA2801 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 1.27 mm.

The HMHAA280 series consists of two gallium arsenide infrared emitting diodes, connected in inverse

parallel, driving a single silicon phototransistor in a compact 4-PIN MINI-FLAT PACKAGE. The lead PITCH is 1.27mm.

FEATURES

• Compact 4-PIN PACKAGE(2.4 mm maximum standoff height)

• Half PITCH leads for optimum board space savings

• Current Transfer Ratio in selected groups

   HMHA2801: 80-600%

   HMHA2801A: 80-160%

   HMHA2801B: 50-150%

   HMHA2801C: 50-100%

   HMHA281: 50-600%

   HMHAA280: 50-600%

• Available in tape and reel quantities of 500 and 2500

• Applicable to Infrared Ray reflow (230°C Max, 30 seconds)

• BSI (File #8611/8612), CSA (File #1201524), UL (File #E90700) and VDE (File #136480) certified

APPLICATIONS

HMHAA280

• AC line monitor

• Unknown polarity DC sensor

• Telephone line receiver



HMHA281, HMHA2801 Series

• Digital logic inputs

• Microprocessor inputs

• Power supply monitor

• Twisted pair line receiver

• Telephone line receiver

■ Description

PC3H510NIP0F contains a IRED optically coupled to a phototransistor. It is PACKAGEd in a 4-PIN MINI-FLAT, Half PITCH type. Input-output isolation voltage(rms) is 2.5kV. CTR is MIN. 600% at input current of 0.5mA.

■ Features

1. 4-PIN MINI-FLAT Half PITCH PACKAGE (Lead PITCH : 1.27mm)

2. Double transfer mold PACKAGE (Ideal for Flow Soldering)

3. Low input current type (IF=0.5mA)

4. Darlington phototransistor output (CTR : MIN. 600% at IF=0.5mA, VCE=2V)

5. Isolation voltage between input and output (Viso(rms) : 2.5kV)

6. Lead-free and RoHS directive compliant

■ Applications

1. Programmable controllers

2. Facsimiles

3. Telephones

■ Description
PC3H2 Series contains a IRED optically coupled to a phototransistor.
It is PACKAGEd in a 4-PIN MINI-FLAT, Half PITCH type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter voltage is 80V(*), CTR is 20% to 400% at input current of 1mA and CMR is MIN. 10kV/µs.

■ Features
1. 4-PIN MINI-FLAT Half PITCH PACKAGE (Lead PITCH : 1.27mm)
2. Double transfer mold PACKAGE (Ideal for Flow Soldering)
3. High collector-emitter voltage (VCEO : 80V(∗))
4. High noise immunity due to high common mode rejection voltage (CMR : MIN. 10kV/µs)
5. Isolation voltage between input and output (Viso(rms) : 2.5kV)

■ Applications
1. Programmable controllers

■ Description
PC3H41xNIP Series contains a IRED optically coupled to a phototransistor.
It is PACKAGEd in a 4-PIN MINI-FLAT, half PITCH type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter Voltage is 80V(∗), CTR is 50% to
400% at input current of ±0.5mA, and CMR is MIN.
10kV/µs.

■ Features
1. 4-PIN MINI-FLAT Half PITCH PACKAGE (Lead PITCH : 1.27mm)
2. Double transfer mold PACKAGE (Ideal for Flow Soldering)
3. AC input type
4. Low input current type (IF=±0.5mA)
5. High collector-emitter voltage (VCEO : 80V(∗))
6. High noise immunity due to high common mode
   rejection voltage (CMR : MIN. 10kV/µs)
7. Isolation voltage between input and output (Viso(rms) : 2.5kV)

■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones

■ Description
PC3H41xNIP0F Series contains a IRED optically coupled to a phototransistor.
It is PACKAGEd in a 4-PIN MINI-FLAT, half PITCH type.
Input-output isolation voltage(rms) is 2.5kV.
Collector-emitter Voltage is 80V, CTR is 50% to
400% at input current of ±0.5mA, and CMR is MIN.
10kV/µs.

■ Features
1. 4-PIN MINI-FLAT Half PITCH PACKAGE (Lead PITCH : 1.27mm)
2. Double transfer mold PACKAGE (Ideal for Flow Soldering)
3. AC input type
4. Low input current type (IF=±0.5mA)
5. High collector-emitter voltage (VCEO : 80V)
6. High noise immunity due to high common mode
   rejection voltage (CMR : MIN. 10kV/µs)
7. Isolation voltage between input and output (Viso(rms) : 2.5kV)
8. RoHS directive compliant

■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones

DESCRIPTION
The FODM452 and FODM453 OPTOCOUPLERS consist of an AlGaAs LED optically coupled to a high speed photodetector transistor.
The devices are housed in a compact 5-pin mini flat PACKAGE for optimum mounting density. The FODM453 features a high CMR rating for optimum common mode transient immunity.

FEATURES
• Compact 5-pin mini flat PACKAGE
• High speed-1 MBit/s
• Superior CMR-15kV/µs at VCM = 1500V (FODM453)
• Performance guaranteed over temperature (0–70°C)
• U.L. recognized (File # E90700)
• VDE0884 recognized (File # 136480)
   – Ordering option V, e.g., FODM452V

APPLICATIONS
• Line receivers
• Pulse transformer replacement
• Output interface to CMOS-LSTTL-TTL
• Wide bandwidth analog coupling

Description
The FODM452 and FODM453 OPTOCOUPLERS consist of an AlGaAs LED optically coupled to a high speed photo-detector transistor. The devices are housed in a compact 5-pin mini flat PACKAGE for optimum mounting density. The FODM453 features a high CMR rating for optimum common mode transient immunity.

Features
■ Compact 5-pin mini flat PACKAGE
■ High speed-1 MBit/s
■ Superior CMR-15kV/µs at VCM = 1500V (FODM453)
■ Performance guaranteed over temperature (0–70°C)
■ U.L. recognized (File # E90700)
■ VDE0884 recognized (File # 136480)
   – Ordering option V, e.g., FODM452V

Applications
■ Line receivers
■ Pulse transformer replacement
■ Output interface to CMOS-LSTTL-TTL
■ Wide bandwidth analog coupling