[CTS]

HEAT DISSIPATORS FOR PLASTIC CASE, CASE-MOUNTED SEMICONDUCTORS

Board-mounted heat dissipators

■ These compact, high-performance heat dissipators have exceptional volume/thermal efficiency ratios, making them especially effective where board space is limited and power levels are high.
■ A wide range of hole patterns is available for single and multiple semiconductor mounting.
■ Various finger heights in the LA, LB and UP Series optimize power dissipation, permit tailoring the heat dissipator to match verical height requirements.