ST72F324J2TCX 查看數據表（PDF） - STMicroelectronics

零件编号

产品描述 (功能)

生产厂家

ST72F324J2TCX

8-bit MCU for automotive, 3.8 to 5.5V operating range with 8 to 32 Kbyte Flash, 10-bit ADC, 4 timers, SPI, SCI

STMicroelectronics 

ST72324xx-Auto

Electrical characteristics

12.8

EMC characteristics

Susceptibility tests are performed on a sample basis during product characterization.

12.8.1 Functional electromagnetic susceptibility (EMS)

Based on a simple running application on the product (toggling two LEDs through I/O ports),

the product is stressed by two electromagnetic events until a failure occurs (indicated by the

LEDs).

● ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device

until a functional disturbance occurs. This test conforms with the IEC 1000-4-2

standard.

● FTB: A burst of fast transient voltage (positive and negative) is applied to VDD and VSS

) through a 100pF capacitor, until a functional disturbance occurs. This test conforms

t(s with the IEC 1000-4-4 standard.

c A device reset allows normal operations to be resumed. The test results given in Table 100

u on page 160 are based on the EMS levels and classes defined in application note AN1709.

rod Designing hardened software to avoid noise problems

P EMC characterization and optimization are performed at component level with a typical

te application environment and simplified MCU software. It should be noted that good EMC

le performance is highly dependent on the user application and the software in particular.

so Therefore it is recommended that the user applies EMC software optimization and

b prequalification tests in relation with the EMC level requested for his application.

O Software recommendations

) - The software flowchart must include the management of runaway conditions such as:

t(s ● corrupted program counter

c ● unexpected reset

du ● critical data corruption (control registers...)

ro Prequalification trials

P Most of the common failures (unexpected reset and program counter corruption) can be

tereproduced by manually forcing a low state on the RESET pin or the oscillator pins for 1

lesecond.

so To complete these trials, ESD stress can be applied directly on the device, over the range of

b specification values. When unexpected behavior is detected, the software can be hardened

O to prevent unrecoverable errors occurring (see application note AN1015).

Doc ID 13841 Rev 1

159/193

Share Link: