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STM32F091VCY6TR 查看數據表(PDF) - STMicroelectronics

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STM32F091VCY6TR Datasheet PDF : 128 Pages
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STM32F091xB STM32F091xC
Package information
Symbol
Table 70. UFBGA100 package mechanical data (continued)
millimeters
inches(1)
Min.
Typ.
Max.
Min.
Typ.
b
0.240
0.290
0.340
0.0094
0.0114
D
6.850
7.000
7.150
0.2697
0.2756
D1
-
5.500
-
-
0.2165
E
6.850
7.000
7.150
0.2697
0.2756
E1
-
5.500
-
-
0.2165
e
-
0.500
-
-
0.0197
Z
-
0.750
-
-
0.0295
ddd
-
-
0.080
-
-
eee
-
-
0.150
-
-
fff
-
-
0.050
-
-
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Max.
0.0134
0.2815
-
0.2815
-
-
-
0.0031
0.0059
0.0020
Figure 34. Recommended footprint for UFBGA100 package
'SDG
'VP
$&B)3B9
Table 71. UFBGA100 recommended PCB design rules
Dimension
Recommended values
Pitch
0.5
Dpad
0.280 mm
Dsm
0.370 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening
0.280 mm
Stencil thickness
Between 0.100 mm and 0.125 mm
DocID026284 Rev 4
101/128
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