STM32F100C8H6BTR(2010) 查看數據表（PDF） - STMicroelectronics

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STM32F100C8H6BTR
(Rev.:2010)

Low & medium-density value line, advanced ARM-based 32-bit MCU with 16 to 128 KB Flash, 12 timers, ADC, DAC & 8 comm interfaces

STMicroelectronics 

List of tables

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Table 45.

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Table 48.

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Table 50.

Table 51.

Table 52.

Table 53.

DAC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

TS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

LQPF100 – 14 x 14 mm, 100-pin low-profile quad flat package mechanical data . . . . . . . 74

LQFP64 – 10 x 10 mm, 64-pin low-profile quad flat package mechanical data . . . . . . . . . 75

TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package mechanical data. . . 76

LQFP48 – 7 x 7 mm, 48-pin low-profile quad flat package mechanical data . . . . . . . . . . . 78

Package thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

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Doc ID 16455 Rev 2

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