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STM8S105K4U3C(2015) 查看數據表(PDF) - STMicroelectronics

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STM8S105K4U3C Datasheet PDF : 121 Pages
First Prev 111 112 113 114 115 116 117 118 119 120
Revision history
STM8S105x4/6
Date
21-Apr-2010
Table 57. Document revision history (continued)
Revision
Changes
Added UFQFPN32 package silhouette to the title page.
In Features: added unique ID.
Section: Clock controller: updated bit positions for TIM2
and TIM3.
Section: Beeper: added information about availability of
the beeper output port through option bit AFR7.
Section: Analog-to-digital converter (ADC1): added a
note concerning additional AIN12 analog input.
Section: STM8S105 pinouts and pin description: added
UFQFPN32 package details; updated default alternate
function of PB2/AIN2[TIM1_CH3N] pin in the "Pin
description for STM8S105 microcontrollers" table.
Section: Option bytes: added description of STM8L
bootloader option bytes to the option byte description
table.
Added Section: Unique ID
Section: Operating conditions: added introductory text;
removed low power dissipation condition for TA,
replaced "CEXT" by "VCAP", and added ESR and ESL
data in table "general operating conditions".
Section: Total current consumption in halt mode:
replaced max value of IDD(H) at 85 °C from 20 µA to 25
µA for the condition "Flash in powerdown mode, HSI
9
clock after wakeup in the table "total current
consumption in halt mode at VDD = 5 V.
Section: Low power mode wakeup times: added first
condition (0 to 16 MHz) for the tWU(WFI) parameter in the
table "wakeup times".
Section: Internal clock sources and timing
characteristics: In the table: HSI oscillator
characteristics, replaced min and max values of
ACCHSI factory calibrated parameter and removed
footnote 4 concerning further characterization of results.
Section: Functional EMS (electromagnetic
susceptibility): IEC 1000 replaced with IEC 61000.
Section: Designing hardened software to avoid noise
problems: IEC 1000 replaced with IEC 61000.
Section: Electromagnetic interference (EMI): SAE J
1752/3 replaced with IEC61967-2.
Section: Thermal characteristics: Replaced the thermal
resistance junction ambient temperature of LQFP32 7X7
mm from 59 °C to 60 °C in the thermal characteristics
table.
Added Section: 32-lead UFQFPN package mechanical
data.
Added Section STM8S105 FASTROM microcontroller
option list.
118/121
DocID14771 Rev 15

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