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M25P10-AMN6TP 查看數據表(PDF) - STMicroelectronics

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M25P10-AMN6TP Datasheet PDF : 50 Pages
First Prev 41 42 43 44 45 46 47 48 49 50
Part numbering
12 Part numbering
M25P10-A
Table 23. Ordering information scheme
Example:
M25P10-A
V MN 6 T P /X
Device Type
M25P
Device Function
10-A = 1 Mbit (128K x 8)
Operating Voltage
V = VCC = 2.7 to 3.6V
Package
MN = SO8 (150 mil width)
MP = VFQFPN8 (MLP8)
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3(1) = Device tested with High Reliability Certified Flow(2).
Automotive temperature range (–40 to 125 °C)
Option
blank = Standard Packing
T = Tape & Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK® (RoHS compliant)
Process(3)
/X = T7Y
1. Device grade 3 available in an SO8 ECOPACK® (RoHS compliant) package.
2. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
3. The process letter (/X) is specified in the ordering information of Grade 3 devices only.
For Grade 6 devices, the process letter does not appear in the Ordering Information, it only appears on the
device package (marking) and on the shipment box. Please contact your nearest ST Sales Office.
For more information on how to identify products by the Process Identification Letter, please refer to
AN1995: Serial Flash Memory Device Marking.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST Sales Office.
The category of second-Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
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