Package characteristics
STM32F030x4/6/8/C
Figure 37. TSSOP20 recommended footprint
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1. Dimensions are in millimeters.
Device marking for TSSOP20
The following figure shows the device marking for the TSSOP20 package.
Figure 38. TSSOP20 marking example (package top view)
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1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet
qualified and therefore not yet ready to be used in production and any consequences deriving from such
usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering
samples in production. ST Quality has to be contacted prior to any decision to use these Engineering
samples to run qualification activity.
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DocID024849 Rev 2