PIC16C58AT-04I/P 查看數據表（PDF） - Microchip Technology
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PIC16C58AT-04I/P Datasheet PDF : 217 Pages
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PIC16C5X
Package Type: K04-052 28-Lead Plastic Small Outline (SO) – Wide, 300 mil
E1
E
p
D
B
n
X
45 °
c
R1
β
2
1
L
R2
A
φ
L1
A2
α
A1
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Pitch
p
0.050
1.27
Number of Pins
n
28
28
Overall Pack. Height
A
0.093
0.099
0.104
2.36
2.50
2.64
Shoulder Height
A1
0.048
0.058
0.068
1.22
1.47
1.73
Standoff
A2
Molded Package Length D‡
Molded Package Width
E‡
0.004
0.700
0.292
0.008
0.706
0.296
0.011
0.712
0.299
0.10
17.78
7.42
0.19
17.93
7.51
0.28
18.08
7.59
Outside Dimension
E1
0.394
0.407
0.419
10.01
10.33
10.64
Chamfer Distance
X
0.010
0.020
0.029
0.25
0.50
0.74
Shoulder Radius
R1
0.005
0.005
0.010
0.13
0.13
0.25
Gull Wing Radius
R2
0.005
0.005
0.010
0.13
0.13
0.25
Foot Length
L
Foot Angle
φ
Radius Centerline
L1
0.011
0.016
0.021
0.28
0.41
0.53
0
4
8
0
4
8
0.010
0.015
0.020
0.25
0.38
0.51
Lead Thickness
c
Lower Lead Width
B†
Mold Draft Angle Top
α
Mold Draft Angle Bottom β
0.009
0.011
0.012
0.23
0.27
0.30
0.014
0.017
0.019
0.36
0.42
0.48
0
12
15
0
12
15
0
12
15
0
12
15
* Controlling Parameter.
† Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
‡ Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
© 1998 Microchip Technology Inc.
Preliminary
DS30453B-page 199
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