
21.0 PACKAGING INFORMATION
21.1 Package Marketing Information
18-Lead PDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead Skinny PDIP (.300")
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead PDIP (.600")
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
XXXXXXXXXXXXXXX
YYWWNNN
18-Lead SOIC
XXXXXXXXXXXX
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
28-Lead SOIC
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
20-Lead SSOP
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
PIC16C5X
Example
PIC16C56A
-04I/P456
0023CBA
Example
PIC16C55A
-04I/SP456
0023CBA
Example
PIC16C55A
-04/P126
0042CDA
Example
PIC16C54C
-04/S0218
0018CDK
Example
PIC16C57C
-04/SO
0015CBK
Example
PIC16C54C
-04/SS218
0020CBP
Example
PIC16C57C
-04/SS123
0025CBK
1997-2013 Microchip Technology Inc.
Preliminary
DS30453E-page 171