M45PE80
13 Reference
● AN1995: Serial Flash Memory Device Marking.
Reference
14 Revision history
Table 21. Document revision history
Date
Version
Changes
10-Feb-2003
02-Apr-2003
08-Apr-2003
1.0 Document written
1.1 VFQFPN8 (MLP) package added
1.2 Document promoted to Product Preview
05-May-2003
04-Jun-2003
26-Nov-2003
23-Jan-2004
28-May-2004
10-May-2005
4-Oct-2005
14-Feb-2006
1.3 Document promoted to Preliminary Data
Description corrected of entering Hardware Protected mode (W must be
1.4 driven, and cannot be left unconnected). Document Revision History for
05-May-2003 corrected.
VIO(min) extended to –0.6V, and tPP(typ) improved to 1.2ms. Table of
2.0
contents, SO16 package, warning about exposed paddle on MLP8, and
Pb-free options added. Change of naming for VDFPN8 package.
Document promoted to full datasheet
3.0 SO16 pin-out corrected
4.0
Soldering temperature information clarified for RoHS compliant devices.
Device Grade clarified
SO16 wide package replaced by SO8 wide package.
Active Power, Stand-by Power and Deep Power-Down modes, Read
Identification (RDID), Deep Power-down (DP), and Release from Deep
5.0 Power-down (RDP) descriptions updated.
Table 20: Ordering information scheme updated.
Figure 22: Output timing updated.
Added Table 13: AC characteristics (33 MHz operation). An easy way to
modify data, A fast way to modify data, Page Write (PW) and Page
6.0
Program (PP) sections updated to explain optimal use of Page Write and
Page Program instructions. Updated ICC3 values in Table 11: DC
characteristics. Updated Table 20: Ordering information scheme
ECOPACK® information added.
X process technology added (see Section 2.5: Reset (Reset), Table 14:
Reset timings for U process technology devices and Table 15: Reset
timings for X process technology devices). MLP package renamed as
7
VFQFPN8, MLP silhouette modified on page 1. TLEAD removed from
Table 7: Absolute maximum ratings.
Table 5: Status Register Format moved from Section 4.7: Status Register
to Section 6.4: Read Status Register (RDSR). Blank option removed
under Plating Technology in Table 20: Ordering information scheme.
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