Data Sheet
Pin # 1 Identifier
512 Kbit Page-Write EEPROM
SST29EE512
1.05
0.95
0.50
BSC
8.10
0.27
7.90
0.17
18.50
18.30
0.70
0.50
20.20
19.80
1.20
max.
Note:
1.Complies with JEDEC publication 95 MO-142 BD dimensions,
although some dimensions may be more stringent.
2.All linear dimensions are in millimeters (max/min).
3.Coplanarity: 0.1 mm
4.Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25mm between leads.
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 20MM
SST PACKAGE CODE: EH
0.15
0.05
DETAIL
0˚- 5˚
0.70
0.50
1mm
32-tsop-EH-7
©2005 Silicon Storage Technology, Inc.
24
S71060-09-000
9/05