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LTC4080X 查看數據表(PDF) - Linear Technology

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LTC4080X Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
PACKAGE DESCRIPTIO
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
0.675 ±0.05
LTC4080X
R = 0.115
TYP
6
0.38 ± 0.10
10
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229
VARIATION OF (WEED-2). CHECK THE LTC WEBSITE DATA
SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10 1.65 ± 0.10
(4 SIDES) (2 SIDES)
0.75 ±0.05
0.00 – 0.05
(DD10) DFN 1103
5
1
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1664)
5.23
(.206)
MIN
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
1
(.081 ± .004)
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
1.83 ± 0.102
(.072 ± .004)
10 9 8 7 6
2.083 ± 0.102 3.20 – 3.45
(.082 ± .004) (.126 – .136)
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.305 ± 0.038
(.0120 ± .0015) TYP
0.50
(.0197) BSC
RECOMMENDED SOLDER PAD LAYOUT
0.254
(.010)
GAUGE PLANE
DETAIL “A”
0° – 6° TYP
0.18
(.007)
0.53 ± 0.152
(.021 ± .006)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.152mm (.006") PER SIDE
10
12345
DETAIL “A”
1.10
(.043)
MAX
0.86
(.034)
REF
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197) BSC
0.127 ± 0.076
(.005 ± .003)
MSOP (MSE) 0603
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm
(.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE
0.102mm (.004") MAX
4080Xf
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,
no responsibility is assumed for its use. Linear Technology Corporation makes no representation that
the interconnection of its circuits as described herein will not infringe on existing patent rights.
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