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LTC3403EDD 查看數據表(PDF) - Linear Technology

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LTC3403EDD Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
LTC3403
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.58 ±0.05
R = 0.115
TYP
5
0.38 ± 0.10
8
3.35 ±0.05
1.65 ±0.05
2.25 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.28 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.200 REF
0.75 ±0.05
0.00 – 0.05
4
0.28 ± 0.05
(DD8) DFN 0902
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3403f
15

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