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HCS370-I/SL(2002) 查看數據表(PDF) - Microchip Technology

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HCS370-I/SL
(Rev.:2002)
Microchip
Microchip Technology 
HCS370-I/SL Datasheet PDF : 36 Pages
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HCS370
9.0 ELECTRICAL CHARACTERISTICS
9.1 Maximum Ratings*
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on VDD w/respect to VSS ................................................................................................................ -0.3 to +7.5V
Voltage on LED w/respect to VSS ..................................................................................................................-0.3 to +11V
Voltage on all other pins w/respect to VSS ........................................................................................-0.3V to VDD + 0.3V
Total power dissipation (Note 1) ..........................................................................................................................500 mW
Maximum current out of VSS pin ...........................................................................................................................100 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Input clamp current, IIK (VI < 0 or VI > VDD) ......................................................................................................... ± 20 mA
Output clamp current, IOK (Vo < 0 or Vo >VDD).................................................................................................... ± 20 mA
Maximum output current sunk by any Output pin....................................................................................................25 mA
Maximum output current sourced by any Output pin ..............................................................................................25 mA
*Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Note 1: Power dissipation is calculated as follows: Pdis=VDD x {IDD - Â IOH} + Â {(VDD-VOH) x IOH} + Â(VOl x IOL).
2002 Microchip Technology Inc.
Preliminary
DS41111D-page 23

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