CS8421 查看數據表（PDF） - Cirrus Logic
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CS8421 Datasheet PDF : 36 Pages
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6. PACKAGE DIMENSIONS
CS8421
20L TSSOP (4.4 MM BODY) PACKAGE DRAWING
N
D
E11
E
A2
A
1 23
TOP VIEW
DIM
MIN
A
--
A1
0.002
A2
0.03346
b
0.00748
D
0.252
E
0.248
E1
0.169
e
--
L
0.020
µ
0°
e
b2
A1
L
SIDE VIEW
SEATING
PLANE
END VIEW
INCHES
NOM
--
0.004
0.0354
0.0096
0.256
0.2519
0.1732
--
0.024
4°
MAX
0.043
0.006
0.037
0.012
0.259
0.256
0.177
0.026
0.028
8°
MILLIMETERS
MIN
NOM
MAX
--
--
1.10
0.05
--
0.15
0.85
0.90
0.95
0.19
0.245
0.30
6.40
6.50
6.60
6.30
6.40
6.50
4.30
4.40
4.50
--
--
0.65
0.50
0.60
0.70
0°
4°
8°
∝
NOTE
2,3
1
1
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Notes:
1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b ” do es no t in clude d ambar pro trusion/intrusion. Allowabl e da mbar protrusion sha ll be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
TSSOP THERMAL CHARACTERISTICS
Parameter
Junction to Ambient Thermal Impedance
Symbol Min
2 Layer Board
4 Layer Board
θJA
-
-
Typ Max
48
-
38
-
Units
°C/Watt
°C/Watt
34
DS641F4
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