
18. PACKAGE DIMENSIONS
28L SOIC (300 MIL BODY) PACKAGE DRAWING
CS8420
EH
1
b
SEATING
PLANE
e
DIM
A
A1
B
C
D
E
e
H
L
∝
c
D
∝
L
A
A1
INCHES
MIN
MAX
0.093
0.104
0.004
0.012
0.013
0.020
0.009
0.013
0.697
0.713
0.291
0.299
0.040
0.060
0.394
0.419
0.016
0.050
0°
8°
MILLIMETERS
MIN
MAX
2.35
2.65
0.10
0.30
0.33
0.51
0.23
0.32
17.70
18.10
7.40
7.60
1.02
1.52
10.00
10.65
0.40
1.27
0°
8°
THERMAL CHARACTERISTICS AND SPECIFICATIONS
Parameter
Junction to Ambient thermal impedance (28 pin SOIC)
Allowable Junction Temperature
Symbol Min Typ Max Units
θJA
-
65
-
°C/W
TJ
-
-
135
°C
92
DS245F4