CS5566(2008) 查看數據表（PDF） - Cirrus Logic

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CS5566
(Rev.:2008)

±2.5 V / 5 V, 5 kSps, 24-bit ∆Σ ADC

Cirrus Logic 

3/25/08

CS5566

5. PACKAGE DIMENSIONS

24L SSOP PACKAGE DRAWING

N

D

E11

1 23

TOP VIEW

DIM

MIN

A

--

A1

0.002

A2

0.064

b

0.009

D

0.311

E

0.291

E1

0.197

e

0.022

L

0.025

∝

0°

E

e

b2

SIDE VIEW

INCHES

NOM

--

0.006

0.068

--

0.323

0.307

0.209

0.026

0.03

4°

MAX

0.084

0.010

0.074

0.015

0.335

0.323

0.220

0.030

0.041

8°

A2

A

∝

A1

L

SEATING

PLANE

END VIEW

MILLIMETERS

MIN

NOM

MAX

--

--

2.13

0.05

0.13

0.25

1.62

1.73

1.88

0.22

--

0.38

7.90

8.20

8.50

7.40

7.80

8.20

5.00

5.30

5.60

0.55

0.65

0.75

0.63

0.75

1.03

0°

4°

8°

NOTE

2,3

1

1

JEDEC #: MO-150

Notes:

Controlling Dimension is Millimeters.

1.“D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold mismatch and are measured

at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side.

2.Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm total in excess of “b”

dimension at maximum material condition. Dambar intrusion shall not reduce dimension “b” by more than 0.07 mm at least

material condition.

3.These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.

DS806PP1

29

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