CS4341 查看數據表（PDF） - Cirrus Logic
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CS4341 Datasheet PDF : 34 Pages
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CS4341
8.2 TSSOP
16L TSSOP (4.4 mm BODY) PACKAGE DRAWING
N
D
E11
E
A2
A
1 23
TOP VIEW
DIM
MIN
A
--
A1
0.002
A2
0.03346
b
0.00748
D
0.193
E
0.248
E1
0.169
e
--
L
0.020
∝
0°
e
b2
A1
L
SIDE VIEW
SEATING
PLANE
END VIEW
INCHES
NOM
--
0.004
0.0354
0.0096
0.1969
0.2519
0.1732
0.026 BSC
0.024
4°
MAX
0.043
0.006
0.037
0.012
0.201
0.256
0.177
--
0.028
8°
MIN
--
0.05
0.85
0.19
4.90
6.30
4.30
--
0.50
0°
MILLIMETERS
NOM
--
--
0.90
0.245
5.00
6.40
4.40
0.65 BSC
0.60
4°
MAX
1.10
0.15
0.95
0.30
5.10
6.50
4.50
--
0.70
8°
∝
NOTE
2,3
1
1
JEDEC #: MO-153
Controlling Dimension is Millimeters
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
9. PACKAGE THERMAL RESISTANCE
SOIC
TSSOP
Package
Symbol Min Typ Max Units
(for multi-layer boards)
θJA
(for multi-layer boards)
θJA
-
74
-
°C/Watt
-
89
-
°C/Watt
DS298F5
33
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