AT88SC0808C-PI 查看數據表（PDF） - Atmel Corporation
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AT88SC0808C-PI Datasheet PDF : 13 Pages
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Packaging Information
Ordering Code: 09ET
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Round - ∅ 8.0 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
AT88SC0808C
Ordering Code: 09CT
Module Size: M4
Dimension*: 12.6 x 12.6 [mm]
Glob Top: Square - 9.0 x 9.0 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
Ordering Code: 09NT
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Square - 8.8 x 8.8 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
Ordering Code: 09DT
Module Size: M4
Dimension*: 12.6 x 12.6 [mm]
Glob Top: Square - 9.0 x 9.0 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
Ordering Code: 09PT
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Square - 8.8 x 8.8 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
*Note: The module dimensions listed refer to the dimensions of the exposed metal contact area.
The actual dimensions of the module after excise or punching from the carrier tape are generally
0.4 mm greated in both directions (i.e., a punched M2 module will yield 13.0 x 11.8 mm).
9
2024BS–SMEM–10/02
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