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AT88SC0404C-MP 查看數據表(PDF) - Atmel Corporation

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AT88SC0404C-MP
Atmel
Atmel Corporation 
AT88SC0404C-MP Datasheet PDF : 14 Pages
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Packaging Information
Ordering Code: MJ
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Round - 8.5 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
Ordering Code: MP
Module Size: M2
Dimension*: 12.6 x 11.4 [mm]
Glob Top: Square - 8.8 x 8.8 [mm]
Thickness: 0.58 [mm]
Pitch: 14.25 mm
*Note: The module dimensions listed refer to the dimensions of the exposed metal contact area. The actual dimensions
of the module after excise or punching from the carrier tape are generally 0.4 mm greater in both directions
(i.e., a punched M2 module will yield 13.0 x 11.8 mm).
10 AT88SC0404C
2023ES–SMEM–07/04

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