AT24C512B-W-113 查看數據表（PDF） - Atmel Corporation
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AT24C512B-W-113 Datasheet PDF : 26 Pages
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Ordering Information
Ordering Code
AT24C512B-PU (Bulk form only)
AT24C512B-PU25 (Bulk form only)
AT24C512BN-SH-B(1) (NiPdAu Lead Finish)
AT24C512BN-SH-T(2) (NiPdAu Lead Finish)
AT24C512BN-SH25-B(1) (NiPdAu Lead Finish)
AT24C512BN-SH25-T(2) (NiPdAu Lead Finish)
AT24C512BW-SH-B(1) (NiPdAu Lead Finish)
AT24C512BW-SH-T(2) (NiPdAu Lead Finish)
AT24C512BW-SH25-B(1) (NiPdAu Lead Finish)
AT24C512BW-SH25-T(2) (NiPdAu Lead Finish)
AT24C512B-TH-B(1) (NiPdAu Lead Finish)
AT24C512B-TH-T(2) (NiPdAu Lead Finish)
AT24C512B-TH25-B(1) (NiPdAu Lead Finish)
AT24C512B-TH25-T(2) (NiPdAu Lead Finish)
AT24C512BY7-YH-T(2) (NiPdAu Lead Finish)
AT24C512BY7-YH25-T(2) (NiPdAu Lead Finish)
AT24C512BU2-UU-T(2)
AT24C512B-W-11(3)
Voltage
1.8
2.5
1.8
1.8
2.5
2.5
1.8
1.8
2.5
2.5
1.8
1.8
2.5
2.5
1.8
2.5
1.8
1.8
Package
8P3
8P3
8S1
8S1
8S1
8S1
8S2
8S2
8S2
8S2
8A2
8A2
8A2
8A2
8Y7
8Y7
8U2-1
Die Sale
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
Industrial Temperature
(–40°C to 85°C)
Notes:
1. “-B” denotes bulk
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel. EIAJ = 2K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.
8P3
8S1
8S2
8A2
8Y7
8U2-1
–1.8
–2.5
Package Type
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
8-ball, die Ball Grid Array Package (dBGA2)
Options
Low-voltage (1.8V to 3.6V)
Low-voltage (2.5V to 5.5V)
12 AT24C512B
5297A–SEEPR–1/08
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