OUTLINE DIMENSIONS
3.00
BSC SQ
0.50
0.40
0.60 MAX
0.30
PIN 1
INDICATOR
TOP
VIEW
2.75
BSC SQ
0.45
0.50
BSC
13
12
16 1
EXPOSED
PAD
9 (BOTTOM VIEW) 4
8
5
12° MAX
0.90
0.85
0.80
SEATING
PLANE
0.30
0.23
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
1.50 REF
0.18
*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 22. 16-Lead Lead Frame Chip Scale Package [VQ_LFCSP]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
PIN 1
INDICATOR
*1.65
1.50 SQ
1.35
0.25 MIN
ADN2891
ORDERING GUIDE
Model
ADN2891ACPZ-500RL71
ADN2891ACPZ-RL71
ADN2891ACPZ-RL1
EVAL-ADN2891EB
1 Z = Pb-free part.
Temperature Range
–40°C to +95°C
–40°C to +95°C
–40°C to +95°C
Package Description
16-Lead VQ_LFCSP, 500 pieces
16-Lead VQ_LFCSP, 1,500 pieces
16-Lead VQ_LFCSP, 5,000 pieces
Evaluation Board
Package Option
CP-16-3
CP-16-3
CP-16-3
Branding
F04
F04
F04
Rev. A | Page 13 of 16