ACST2-8SFP 查看數據表（PDF） - STMicroelectronics
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ACST2-8SFP Datasheet PDF : 11 Pages
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ACST2 Series
Package information
Table 6. DPAK dimensions
Ref.
A
E
A
A1
B2
C2
A2
L2
B
H
L4
B
G
B2
D
R
C
C2
A1
R
D
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
Figure 18. Footprint (dimensions in mm)
Dimensions
Millimeters
Inches
Min.
Max.
2.20
2.40
0.90
1.10
0.03
0.23
0.64
0.90
5.20
5.40
0.45
0.60
0.48
0.60
6.00
6.20
6.40
6.60
4.40
4.60
9.35 10.10
0.80 typ.
0.60
1.00
0°
8°
Min.
Max.
0.086 0.094
0.035 0.043
0.001 0.009
0.025 0.035
0.204 0.212
0.017 0.023
0.018 0.023
0.236 0.244
0.251 0.259
0.173 0.181
0.368 0.397
0.031 typ.
0.023 0.039
0°
8°
6.7
3
3
1.6
2.3
6.7
2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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