STM32F407VGY6 查看數據表（PDF） - STMicroelectronics

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STM32F407VGY6

ARM Cortex-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera

STMicroelectronics 

STM32F405xx, STM32F407xx

Package characteristics

6.2

Thermal characteristics

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 96. Package thermal characteristics

Symbol

Parameter

Value

Thermal resistance junction-ambient

LQFP64 - 10 × 10 mm / 0.5 mm pitch

46

Thermal resistance junction-ambient

LQFP100 - 14 × 14 mm / 0.5 mm pitch

43

Thermal resistance junction-ambient

LQFP144 - 20 × 20 mm / 0.5 mm pitch

40

ΘJA

Thermal resistance junction-ambient

LQFP176 - 24 × 24 mm / 0.5 mm pitch

38

Thermal resistance junction-ambient

UFBGA176 - 10× 10 mm / 0.65 mm pitch

39

Thermal resistance junction-ambient

WLCSP90 - 0.400 mm pitch

38.1

Unit

°C/W

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org.

DocID022152 Rev 4

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