STM8S103xx, STM8S105xx
Electrical characteristics
Table 11. Current characteristics
Symbol
Ratings
Max.
Unit
IVDD
Total current into VDD power lines (source)(1)
60
IVSS
Total current out of VSS ground lines (sink)(1)
60
Output current sunk by any I/O and control pin
IIO
Output current source by any I/Os and control pin
Injected current on NRST pin
20
- 20
mA
±4
IINJ(PIN)(2)(3) Injected current on OSCIN pin
±4
Injected current on any other pin(4)
±4
ΣIINJ(PIN)(2) Total injected current (sum of all I/O and control pins)(4)
± 20
1. All power (VDD, VDDIO, VDDA) and ground (VSS, VSSIO, VSSA) pins must always be connected to the
external supply.
2. IINJ(PIN) must never be exceeded. This is implicitly insured if VIN maximum is respected. If VIN maximum
cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A positive
injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. For true open-drain pads,
there is no positive injection current, and the corresponding VIN maximum must always be respected
3. Negative injection disturbs the analog performance of the device.
4. When several inputs are submitted to a current injection, the maximum ΣIINJ(PIN) is the absolute sum of the
positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
Table 12. Thermal characteristics
Symbol
Ratings
Value
Unit
TSTG
TJ
Storage temperature range
Maximum junction temperature
-65 to +150
°C
150
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