M95512-WCS3/AB 查看數據表（PDF） - STMicroelectronics

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M95512-WCS3/AB

512 Kbit serial SPI bus EEPROM with high-speed clock

STMicroelectronics 

Package mechanical data

M95512-W, M95512-R

Figure 24. TSSOP8 – 8 lead thin shrink small outline, package outline

D

8

5

c

E1 E

1

4

α

A

CP

A1

L

A2

L1

b

e

TSSOP8AM

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 20.

Symbol

TSSOP8 – 8 lead thin shrink small outline, package mechanical data

millimeters

inches(1)

Typ

Min

Max

Typ

Min

Max

A

1.200

0.0472

A1

0.050

0.150

0.0020

0.0059

A2

1.000

0.800

1.050

0.0394

0.0315

0.0413

b

0.190

0.300

0.0075

0.0118

c

0.090

0.200

0.0035

0.0079

CP

0.100

0.0039

D

3.000

2.900

3.100

0.1181

0.1142

0.1220

e

0.650

–

–

0.0256

–

–

E

6.400

6.200

6.600

0.2520

0.2441

0.2598

E1

4.400

4.300

4.500

0.1732

0.1693

0.1772

L

0.600

0.450

0.750

0.0236

0.0177

0.0295

L1

1.000

0.0394



0°

8°

0°

8°

N

8

8

1. Values in inches are converted from mm and rounded to 4 decimal digits.

40/48

Doc ID 11124 Rev 13

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