CS48LV12-ENZR 查看數據表（PDF） - Cirrus Logic
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CS48LV12-ENZR Datasheet PDF : 26 Pages
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6 Package Dimensions
Table 6-1. WLCSP Package Dimension (Cont.)
Symbol
aaa
bbb
ccc
ddd
eee
Description
Package edge tolerance
Wafer flatness
Coplanarity
Ball/bump offset (package)
Ball/bump offset (ball)
Dimensions
0.05
0.1
0.03
0.15
0.05
1.Basic spacing between centers.
7. Controlling dimensions are in millimeters.
8. Dimensioning and tolerancing per ASME Y 14.5M.
9. Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the package body
and the seating plane.
10.Recommended reflow profile is per JEDEC/IPC J-STD-020.
24-PIN QFN (4 mm x 4 mm Body) Package Drawing
DIM
A
A1
A3
b
D
D2
e
E
E2
L
aaa
bbb
ddd
eee
25
Table 6-2. QFN Package Dimension
MILLIMETERS
MIN
NOM
MAX
0.80
0.90
1.00
0.00
0.02
0.05
0.20 REF
0.20
0.25
0.30
4.00 BSC
2.60
2.70
2.80
0.50 BSC
4.00 BSC
2.60
2.70
2.80
0.30
0.40
0.50
0.15
0.10
0.05
0.08
MIN
0.031
0.000
0.008
0.102
0.102
0.012
INCHES
NOM
0.035
0.001
0.008 REF
0.010
0.157 BSC
0.106
0.020 BSC
0.157 BSC
0.106
0.016
0.006
0.004
0.002
0.003
MAX
0.039
0.002
0.012
0.110
0.110
0.020
DS1057F1
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