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STM32F103RC 查看數據表(PDF) - STMicroelectronics

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STM32F103RC Datasheet PDF : 123 Pages
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Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6
Package characteristics
6.1
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 58. Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dpad
Dsm
Dpad
0.37 mm
Dsm
0.52 mm typ. (depends on solder mask
registration tolerance
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
ai15469
106/123
Doc ID 14611 Rev 7

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