LTC2600CUFD 查看數據表（PDF） - Linear Technology

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LTC2600CUFD

Octal 16-/14-/12-Bit Rail-to-Rail DACs in 16-Lead SSOP

Linear Technology 

LTC2600/LTC2610/LTC2620

PACKAGE DESCRIPTION

UFD Package

20-Lead Plastic QFN (4mm × 5mm)

(Reference LTC DWG # 05-08-1711 Rev B)

0.70 p0.05

4.50 p 0.05 1.50 REF

3.10 p 0.05

2.65 p 0.05

3.65 p 0.05

PACKAGE OUTLINE

0.25 p0.05

0.50 BSC

2.50 REF

4.10 p 0.05

5.50 p 0.05

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED

4.00 p 0.10

(2 SIDES)

0.75 p 0.05

PIN 1

TOP MARK

(NOTE 6)

R = 0.05 TYP

1.50 REF

19 20

5.00 p 0.10

(2 SIDES)

2.50 REF

3.65 p 0.10

2.65 p 0.10

PIN 1 NOTCH

R = 0.20 OR

C = 0.35

0.40 p 0.10

1

2

0.200 REF

0.00 – 0.05

R = 0.115

TYP

(UFD20) QFN 0506 REV B

0.25 p 0.05

0.50 BSC

BOTTOM VIEW—EXPOSED PAD

NOTE:

1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

2600fe

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