CS61881-IB 查看數據表（PDF） - Cirrus Logic

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CS61881-IB

Octal E1 Analog Front End

Cirrus Logic 

CS61881

160-BALL FBGA (2 LAYER) PACKAGE DRAWING

A

15.00/M+3A1BE0.20

Pin #A1 Corner

13.00 ± 0.20

B

15.00/M+3A1BE0.20

13.00 ± 0.20

A

Pin #A1 Identifier (shiny)

∅1.00x0.15 Depth

A

3.0°

4.72 ±0.10

8xR0.5

3

Seating Plane

0.20 (4x)

3x∅1.00

1.00 REF

2

0.50 ± 0.10

A

B

∅0.30 M C A B

C

∅0.10 C

D

E

F

G

H

I

J

K

L

M

4.72 ± 0.10

TOP VIEW

13.00

1.00

4x1.20x45

1.00

13.00

0.36 ± 0.04

0.85

0.40 ± 0.10

1.61 ± 0.19

SIDE VIEW

14 13 12 11 10 9 8 7 6 5 4 3 21

BOTTOM VIEW

1.00 REF

JEDEC #: MO-158

Notes: 14. All dimensions and tolerance conform to ASME Y 14.5 M - 1994.

2 Dimension is measured at the maximum solder ball diameter, parallel to primary datum C .

3 Primary datum C and seating plane are defined by the spherical crowns of the solder balls.

4. Maximum mold to substrate offset shall be 0.127.

5. The surface finish of the package shall be EDM charmille #18 - #21.

6. Unless otherwise specified tolerance: Decimal ±0.05; Angular ±2

DS451PP3

25

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