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J100J

  

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TDK
TDK Corporation
C2012X7S0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C2012X7S0J100J PDF
ETC
Unspecified
MMK5105J100J06L16.5TR16 Metallized polyester According to CECC 30401-042, IEC 60384-2, DIN 44122

construction
Metallized polyester flm capacitor. Radial leads of tinned wire are electrically welded to the contact metal layer on the ends of the capacitor winding. Encapsulation in self-extinguishing material meeting the requirements of UL 94V-0.

typical applications
Bypassing, signal coupling. General purpose for highest reliability.


other parts : MMK5272J100J01L16.5TR16  MMK5273J63J01L4BULK  MMK5105J100J06L16.5TR18  MMK5224J250J05L16.5TA18  MMK5224J250J05L4BULK  MMK5224J250J05L16.5TR18  MMK5224J250J05L16.5TR16  MMK10224J250A02L4BULK  MMK15224J250B04L4BULK  MMK22.5124M630D13L4TRAY  
MMK5105J100J06L16.5TR16 PDF
TDK
TDK Corporation
C0402JB0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C0402JB0J100J PDF
TDK
TDK Corporation
C3216X6S0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C3216X6S0J100J PDF
TDK
TDK Corporation
C0603C0G0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C0603C0G0J100J PDF
TDK
TDK Corporation
C0603X7R0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C0603X7R0J100J PDF
TDK
TDK Corporation
C3225JB0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C3225JB0J100J PDF
TDK
TDK Corporation
C1005X5R0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C1005X5R0J100J PDF
TDK
TDK Corporation
C4532C0G0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C4532C0G0J100J PDF
TDK
TDK Corporation
C1608CH0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C1608CH0J100J PDF
TDK
TDK Corporation
C4532X7R0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C4532X7R0J100J PDF
TDK
TDK Corporation
C5750X5R0J100J MULTILAYER CERAMIC CHIP CAPACITORS

Features
• High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers.
• A monolithic structure ensures superior mechanical strength and reliability.
• Low ESL and excellent frequency characteristics allow for a circuit design that closely conforms to theoretical values.
• Low self-heating and high ripple resistance due to low ESR.

Applications
• General electronic equipment
• Mobile communication equipment
• Power supply circuit
• Office automation equipment
• TV, LED displays
• Servers, PCs, Notebooks, Tablets


other parts : C0402  C1005C0G1HR75B(  C0402C0G0G010B  C0402C0G0G010C  C0402C0G0G010D  C0402C0G0G010F  C0402C0G0G010G  C0402C0G0G010J  C0402C0G0G010K  C0402C0G0G010M  
C5750X5R0J100J PDF

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