STM32L152R8H6TR(2013) Просмотр технического описания (PDF) - STMicroelectronics

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производитель

STM32L152R8H6TR
(Rev.:2013)

Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC

STMicroelectronics 

STM32L151x6/8/B, STM32L152x6/8/B

Package characteristics

Figure 37. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline

Pin 1 indentifier

laser marking area

D

EE

T

D

Y

A

Seating

ddd

A1 plane

e

b

Detail Y

Exposed pad

area

D2

E2

1

C 0.500x45°

pin1 corner

48

Detail Z

L

R 0.125 typ.

1

Z

48

A0B9_ME_V3

1. Drawing is not to scale.

1. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

1. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

Doc ID 17659 Rev 8

109/121

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