STM32L151VB 데이터 시트보기 (PDF) - STMicroelectronics

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STM32L151VB

Ultra-low-power 32-bit MCU ARM®-based Cortex®-M3, 128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC

STMicroelectronics 

Package information

STM32L151x6/8/B STM32L152x6/8/B

7.4

UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information

Figure 41. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline

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1. Drawing is not to scale.

2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.

3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and

solder this back-side pad to PCB ground.

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DocID17659 Rev 12

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