PIC16F914T-E/SO 데이터 시트보기 (PDF) - Microchip Technology

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PIC16F914T-E/SO

28/40/44/64-Pin Flash-Based, 8-Bit CMOS Microcontrollers with LCD Driver and nanoWatt Technology

Microchip Technology 

PIC16F913/914/916/917/946

TABLE 19-4: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER

AND BROWN-OUT RESET PARAMETERS

Standard Operating Conditions (unless otherwise stated)

Operating Temperature -40°C ≤ TA ≤ +125°C

Param

No.

Symbol

Characteristic

Min. Typ†

Max. Units

Conditions

30

TMCL MCLR Pulse Width (low)

2

—

— μs VDD = 5V, -40°C to +85°C

5

—

— μs VDD = 5V

31

TWDT Watchdog Timer Time-out

Period (No Prescaler)

10

16

29 ms VDD = 5V, -40°C to +85°C

10

16

31 ms VDD = 5V

32

TOST Oscillation Start-up Timer

Period(1, 2)

—

1024

— TOSC (NOTE 3)

33* TPWRT Power-up Timer Period

40

65

140 ms

34* TIOZ I/O High-impedance from

—

MCLR Low or Watchdog Timer

Reset

—

2.0 μs

35

VBOR Brown-out Reset Voltage

2.0

—

2.2 V -40°C to +85°C, (NOTE 4)

2.0

—

2.25 V -40°C to +125°C, (NOTE 4)

36* VHYST Brown-out Reset Hysteresis

—

50

— mV

37* TBOR Brown-out Reset Minimum

Detection Period

100

—

— μs VDD ≤ VBOR

* These parameters are characterized but not tested.

† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance

only and are not tested.

Note 1:

Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values

are based on characterization data for that particular oscillator type under standard operating conditions

with the device executing code. Exceeding these specified limits may result in an unstable oscillator oper-

ation and/or higher than expected current consumption. All devices are tested to operate at “min” values

with an external clock applied to the OSC1 pin. When an external clock input is used, the “max” cycle time

limit is “DC” (no clock) for all devices.

2: By design.

3: Period of the slower clock.

4: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as

possible. 0.1 μF and 0.01 μF values in parallel are recommended.

© 2007 Microchip Technology Inc.

DS41250F-page 269

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