datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

STM32F100VBH6B 데이터 시트보기 (PDF) - STMicroelectronics

부품명
상세내역
제조사
STM32F100VBH6B Datasheet PDF : 96 Pages
First Prev 31 32 33 34 35 36 37 38 39 40 Next Last
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Electrical characteristics
Note:
5.3.2
5.3.3
Table 8. General operating conditions (continued)
Symbol
Parameter
Conditions
Min Max Unit
LQFP100
Power dissipation at TA =
LQFP64
PD
81505°C°Cfofrorsusfufifxfix67o(2r )TA =
TFBGA64
LQFP48
-
434
-
444
mW
-
308
-
363
Ambient temperature for 6
suffix version
Maximum power dissipation –40 85
Low power dissipation(3)
–40 105
°C
TA
Ambient temperature for 7
suffix version
Maximum power dissipation –40 105
Low power dissipation(3)
–40 125
°C
6 suffix version
TJ
Junction temperature range
7 suffix version
–40 105
°C
–40 125
1. When the ADC is used, refer to Table 42: ADC characteristics.
2.
cIfhTaAraisctleorwisetirc, shiognhepraPgeD
values
89).
are
allowed
as
long
as
TJ
does
not
exceed
TJmax
(see
Table
6.5:
Thermal
3.
In low
Table
6p.o5w: Terhdeirsmsaiplacthioanrasctateteri,sTticAscoann
be extended
page 89).
to
this
range
as
long
as
TJ
does
not
exceed
TJmax
(see
It is recommended to power VDD and VDDA from the same source. A maximum difference of
300 mV between VDD and VDDA can be tolerated during power-up and operation.
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9. Operating conditions at power-up / power-down
Symbol
Parameter
Min
Max
Unit
tVDD
VDD rise time rate
VDD fall time rate
0
µs/V
20
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
DocID16455 Rev 9
35/96
95

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]