STM32F051C8H6TR 데이터 시트보기 (PDF) - STMicroelectronics
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STM32F051C8H6TR
STMicroelectronics
STM32F051C8H6TR Datasheet PDF : 122 Pages
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STM32F051x4 STM32F051x6 STM32F051x8
Package information
Figure 52. UFQFPN32 package outline
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1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
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