STM32F030RC(2015) 데이터 시트보기 (PDF) - STMicroelectronics

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STM32F030RC
(Rev.:2015)

Value-line ARM®-based 32-bit MCU with up to 256-KB Flash, timers, ADC, communication interfaces, 2.4-3.6 V operation

STMicroelectronics 

STM32F030x4/6/8/C

Package characteristics

7.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 21: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

• TA max is the maximum ambient temperature in °C,

• ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

• PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

• PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ ((VDD - VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

Table 63. Package thermal characteristics

Symbol

Parameter

Value

Thermal resistance junction-ambient

LQFP64 - 10 mm x 10 mm

44

Thermal resistance junction-ambient

LQFP48 - 7 mm x 7 mm

55

ΘJ Thermal resistance junction-ambient

LQFP32 - 7 mm x 7 mm

56

Thermal resistance junction-ambient

TSSOP20 - 6.5 mm x 6.4 mm

76

Unit

°C/W

7.2.1

Reference document

JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural

Convection (Still Air). Available from www.jedec.org

DocID024849 Rev 2

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