SC4524CEVB 데이터 시트보기 (PDF) - Semtech Corporation
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SC4524CEVB Datasheet PDF : 22 Pages
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SC4524C
Land Pattern - SOIC-8 EDP
E
D
(C) F
THERMAL VIA
P
Ø 0.36mm
SOLDER MASK
DIM
Z
G
C
D
E
F
Y
G
P
X
Y
X
Z
DIMENSIONS
INCHES
MILLIMETERS
(.205)
(5.20)
.134
3.40
.201
5.10
.101
2.56
.118
3.00
.050
1.27
.024
0.60
.087
2.20
.291
7.40
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.
REFERENCE IPC-SM-782A, RLP NO. 300A.
3.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
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