M95160-FMN6TP(2014) 데이터 시트보기 (PDF) - STMicroelectronics

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M95160-FMN6TP
(Rev.:2014)

16-Kbit serial SPI bus EEPROM with high-speed clock

STMicroelectronics 

Package mechanical data

M95160 M95160-W M95160-R M95160-DF

Figure 26. WLCSP-R–1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline

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8

9

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AAA

8

7!&%2"!#+3)$%

BBB :

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3)$%6)%7

(

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E

E

E

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3EATINGPLANE 

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1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.

2. Drawing is not to scale.

3. Preliminary data.

Table 24. WLCSP-R – 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical

data (preliminary data)

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

0.545

0.490

0.600

0.0193

0.0215

0.0236

A1

0.190

-

-

0.0075

-

-

A2

0.355

-

-

0.014

-

-

b(2)

0.270

0.240

0.300

0.0106

0.0094

0.0118

D

1.350

-

1.475

0.0531

-

0.0581

E

1.365

-

1.490

0.0537

-

0.0587

e

0.400

-

-

0.0157

-

-

e1

0.800

-

-

0.0315

-

-

F

0.282

-

-

0.0111

-

-

G

0.275

-

-

0.0108

-

-

N (total number of

terminals)

aaa

8

0.110

8

0.0043

eee

0.060

0.0024

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

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