datasheetbank_Logo
전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

LTC4098EUDC-3.6 데이터 시트보기 (PDF) - Linear Technology

부품명
상세내역
제조사
LTC4098EUDC-3.6 Datasheet PDF : 32 Pages
First Prev 31 32
PACKAGE DESCRIPTION
UDC Package
20-Lead Plastic QFN (3mm × 4mm)
(Reference LTC DWG # 05-08-1742 Rev Ø)
LTC4098-3.6
3.50 ± 0.05
2.10 ± 0.05
1.50 REF
2.65 ± 0.05
1.65 ± 0.05
0.70 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
2.50 REF
3.10 ± 0.05
4.50 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ± 0.10
0.75 ± 0.05
R = 0.05 TYP
4.00 ± 0.10
PIN 1
TOP MARK
(NOTE 6)
2.50 REF
1.50 REF
19 20
2.65 ± 0.10
1.65 ± 0.10
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.40 ± 0.10
1
2
0.200 REF
0.00 – 0.05
(UDC20) QFN 1106 REV Ø
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
409836f
31

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]