CS4272 데이터 시트보기 (PDF) - Cirrus Logic
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CS4272 Datasheet PDF : 53 Pages
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CS4272
10.PACKAGE DIMENSIONS
28L TSSOP (4.4 mm BODY) PACKAGE DRAWING
N
E
1 23
TOP VIEW
D
E11
A2
A
∝
e
b2
A1
L
END VIEW
SIDE VIEW
SEATING
PLANE
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
--
0.47
--
--
1.20
A1
0.002
0.004
0.006
0.05
0.10
0.15
A2
0.03150
0.035
0.04
0.80
0.90
1.00
b
0.00748
0.0096
0.012
0.19
0.245
0.30
2,3
D
0.378 BSC 0.382 BSC 0.386 BSC 9.60 BSC
9.70 BSC
9.80 BSC
1
E
0.248
0.2519
0.256
6.30
6.40
6.50
E1
0.169
0.1732
0.177
4.30
4.40
4.50
1
e
--
0.026 BSC
--
--
0.65 BSC
--
L
0.020
0.024
0.029
0.50
0.60
0.75
∝
0°
4°
8°
0°
4°
8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Notes: 1. “D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not
reduce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS AND SPECIFICATIONS
Parameters
Package Thermal Resistance (Note 4)
Allowable Junction Temperature
Symbol Min Typ
28-TSSOP θJA
-
37
θJC
-
13
-
-
Notes: 4. θJA is specified according to JEDEC specifications for multi-layer PCBs.
Max Units
-
°C/Watt
-
°C/Watt
135
°C
46
DS593F1
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