AMPMODU Interconnection System
Dual Entry, End Stackable,
Low Profile, .100 x .100
[2.54 x 2.54] Centerline,
.200 [5.08] Tine Spacing
Mod IV Receptacle Assemblies, Single-Row, Outrigger Design
.100 x .100 [2.54 x 2.54] Centerline, End To End Stackable
.125±.010
[3.17±0.25]
Typ.
.020
[0.51]
(Standoffs)
.245
[6.22]
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
.140
Plating A — Duplex .000030 [0.00076]
[3.56]
gold on contact area, .000150-0.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B — Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C — .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
A
.148
[3.77]
Typ.
Point of
Contact
.107
[2.72]
(Localized Gold
Plate Area)
.200±.003
[5.08±0.08]
Typ.
.100
[2.54]
Typ.
.140
[3.56]
.053
[1.34]
Typ.
B
.075
+.005
-.000
[ ] 1.90
+0.13
-.000
.200
[5.08]
.035±.003
[0.89±0.08]
Dia.
.100
[2.54]
Typ.
Recommended PC Board Hole Layout
No. of
Pos.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
30
40
Dimensions
A
B
.300 [7.62]
.200 [5.08]
.400 [10.16]
.300 [7.62]
.500 [12.70]
.400 [10.16]
.600 [15.24]
.500 [12.70]
.700 [17.78]
.600 [15.24]
.800 [20.32]
.700 [17.78]
.900 [22.86]
.800 [20.32]
1.000 [25.40]
.900 [22.86]
1.100 [27.94]
1.000 [25.40]
1.200 [30.48]
1.100 [27.94]
1.300 [33.02]
1.200 [30.48]
1.400 [35.56]
1.300 [33.02]
1.500 [38.10]
1.400 [35.56]
1.600 [40.64]
1.500 [38.10]
1.700 [43.18]
1.600 [40.64]
1.800 [45.72]
1.700 [43.18]
1.900 [48.26]
1.800 [45.72]
2.000 [50.80]
1.900 [48.26]
3.000 [76.20]
2.900 [73.66]
4.000 [101.60]
3.900 [99.06]
Contact Plating/Part Nos.
Plating A
Plating B
5-147720-2
5-147726-2
5-147720-3
5-147726-3
5-147720-4
5-147726-4
5-147720-5
5-147726-5
5-147720-6
5-147726-6
5-147720-7
5-147726-7
5-147720-8
5-147726-8
5-147720-9
5-147726-9
6-147720-0
6-147726-0
6-147720-1
6-147726-1
6-147720-2
6-147726-2
6-147720-3
6-147726-3
6-147720-4
6-147726-4
6-147720-5
6-147726-5
6-147720-6
6-147726-6
6-147720-7
6-147726-7
6-147720-8
6-147726-8
7-147720-8
7-147726-8
8-147720-8
8-147726-8
8-147720-9
8-147726-9
Plating C
5-147727-2
5-147727-3
5-147727-4
5-147727-5
5-147727-6
5-147727-7
5-147727-8
5-147727-9
6-147727-0
6-147727-1
6-147727-2
6-147727-3
6-147727-4
6-147727-5
6-147727-6
6-147727-7
6-147727-8
7-147727-8
8-147727-8
8-147727-9
Note: All part numbers are RoHS
compliant.
Notes: 1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle
assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
the maximum point-of-contact dimension and add .062 [1.57] for recommended board thickness if used in
bottom entry application.
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
181
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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