STM32F103RC 데이터 시트보기 (PDF) - STMicroelectronics

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STM32F103RC

Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces

STMicroelectronics 

STM32F103xC, STM32F103xD, STM32F103xE

Electrical characteristics

Figure 54. Typical connection diagram using the ADC

RAIN(1)

AINx

VAIN

Cparasitic

VDD

VT

0.6 V

VT

0.6 V

IL±1 µA

STM32F103xx

Sample and hold ADC

converter

RADC(1)

12-bit

converter

CADC(1)

ai14150c

1. Refer to Table 58 for the values of RAIN, RADC and CADC.

2. Cparasitic represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the

pad capacitance (roughly 7 pF). A high Cparasitic value will downgrade conversion accuracy. To remedy

this, fADC should be reduced.

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 55 or Figure 56,

depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be

ceramic (good quality). They should be placed them as close as possible to the chip.

Figure 55. Power supply and reference decoupling (VREF+ not connected to VDDA)

STM32F103xx

VREF+

(see note 1)

1 µF // 10 nF

1 µF // 10 nF

VDDA

VSSA /VREF–

(see note 1)

ai14388b

1. VREF+ and VREF– inputs are available only on 100-pin packages.

Doc ID 14611 Rev 7

101/123

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