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전자부품 반도체 검색엔진( 무료 PDF 다운로드 ) - 데이터시트뱅크

CS61881-IB 데이터 시트보기 (PDF) - Cirrus Logic

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제조사
CS61881-IB
Cirrus-Logic
Cirrus Logic 
CS61881-IB Datasheet PDF : 28 Pages
First Prev 21 22 23 24 25 26 27 28
CS61881
160-BALL FBGA (2 LAYER) PACKAGE DRAWING
A
15.00/M+3A1BE0.20
Pin #A1 Corner
13.00 ± 0.20
B
15.00/M+3A1BE0.20
13.00 ± 0.20
A
Pin #A1 Identifier (shiny)
1.00x0.15 Depth
A
3.0°
4.72 ±0.10
8xR0.5
3
Seating Plane
0.20 (4x)
3x1.00
1.00 REF
2
0.50 ± 0.10
A
B
0.30 M C A B
C
0.10 C
D
E
F
G
H
I
J
K
L
M
4.72 ± 0.10
TOP VIEW
13.00
1.00
4x1.20x45
1.00
13.00
0.36 ± 0.04
0.85
0.40 ± 0.10
1.61 ± 0.19
SIDE VIEW
14 13 12 11 10 9 8 7 6 5 4 3 21
BOTTOM VIEW
1.00 REF
JEDEC #: MO-158
Notes: 14. All dimensions and tolerance conform to ASME Y 14.5 M - 1994.
2 Dimension is measured at the maximum solder ball diameter, parallel to primary datum C .
3 Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ±0.05; Angular ±2
DS451PP3
25

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